Thank you for choosing to fulfill your operational requirements for the Microcircuitmemory NSN parts you require with Buy Ground Support Equipment. On this page, you can submit a quote request for St Microelectronics Ltd part number MKB4118-3, a component that can also be found by inputting NSN 5962-01-113-7050 in our search engine. Alongside part number MKB4118-3, we also have a wide range of other related items available, all of which can be traced back to a wealth of trusted manufacturers on our Approved Vendor List (AVL).
Buy Ground Support Equipment works with numerous government and defense agencies, so we use CAGE Codes like 50088 to uniquely identify items and their manufacturers in a standardized manner. We also utilize Federal Supply Classes (FSCs) to organize our inventory, ensuring customers can find St Microelectronics Ltd part number MKB4118-3 by the FSC designation 5962 Microcircuits Electronic with ease. That being said, we encourage you to complete the RFQ form below for NSN 5962011137050 or any others that you are interested in, and we will provide you with a customized sourcing solution in 15 minutes or less. For one-on-one assistance, contact us via phone or email at any time; we are available 24/7x365!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-113-7050 Item Description: MICROCIRCUIT,MEMORY | 5962 | 011137050 | N | |||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
MKB4118-3 | 3 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CZEQ | Time Rating Per Chacteristic | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
CQZP | Input Circuit Pattern | 18 INPUT |
TEST | Test Data Document | 13973-839201-0018 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
CQSJ | Inclosure Material | CERAMIC |
MRC | Decoded Requirement | Clear Text Reply |
TTQY | Terminal Type And Quantity | 24 PRINTED CIRCUIT |
ADAT | Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND PROGRAMMABLE AND PROGRAMMED |
CWSG | Terminal Surface Treatment | SOLDER |
ADAQ | Body Length | 1.290 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
ADAU | Body Height | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
CTFT | Case Outline Source And Designator | D-3 MIL-M-38510 |
AFGA | Operating Temp Range | +0.0/+70.0 DEG CELSIUS |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
CZER | Memory Device Type | RAM |
CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
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